OCZ Technology Group on Wednesday said that its Deneva solid-state drives in mSATA form-factor have been certified by Intel Corp. to power ultrabooks, thin-and-lightweight notebooks with maximum responsiveness and performance amid reduced power consumption. OCZ's Deneva 2 are among the first non-Intel SSDs to get such certification.
OCZ Deneva 2 30GB and 60GB mSATA SSDs have been tested with Intel Smart Response technology and have passed the performance benchmarks for the ‘While Using’ portion of the responsiveness requirements in the 2012 ultrabook definition. OCZ Deneva 2 mSATA solutions are significantly slimmer than traditional 2.5" storage devices, enabling the ultrabook to support low-profile dimensions less than 21mm thick without compromising on storage capacity, speed, or battery life. OCZ also ships 120GB version of Deneva 2.
OCZ Deneva 2 SSDs are based on SandForce 2141/2181 controller and utilize multi-level cell (MLC) NAND flash memory produced using a 20nm-class process technology. The manufacturer declares [for 120GB model] maximum read speed of 280MB/s and maximum 11500 IOPS read operations as well as maximum write speed of up to 260MB/s along with 32000 IOPS write operations. The solid-state drives weigh 6 grams and consume up to 1.7W.
"We are pleased with the results that Intel has achieved with our Deneva 2 mSATA products. The Deneva 2 SSDs have a very small footprint making them ideal for the slim and stylish Ultrabook designs, and also deliver exceptionally fast bootup and data transfer speeds for a superior instant-on and overall more responsive computing experience," said Tobias Brinkmann, vice president of partner relations at OCZ Technology.
Thursday, January 5, 2012
Wednesday, January 4, 2012
Samsung reports increase in profits
Thanks to smartphones
Samsung is set to report a robust quarterly profit rise on Friday, starting the year on an upbeat note aided by sales of smartphones. Samsung is now the world's top smartphone maker in the third quarter, is continuing to give Apple a good kicking with sleek designs and a rich product line-up.
Its handset division is now Samsung's biggest earnings generator, raking in record profits. The company appears to be dealing with a profit squeeze from its memory chips with new revenue sources such as mobile processing chips and high-end OLED displays.
The world's biggest technology firm by revenue is likely to report $4.1 billion in October-December analyts think. That would be its best profit since the third quarter of 2010, and up 57 percent from a year ago and 11 percent from the preceding quarter.
In 2012, Samsung is likely to report a 28 percent rise in operating profit with a 12 percent gain in revenue, according to analysts.
Samsung is set to report a robust quarterly profit rise on Friday, starting the year on an upbeat note aided by sales of smartphones. Samsung is now the world's top smartphone maker in the third quarter, is continuing to give Apple a good kicking with sleek designs and a rich product line-up.
Its handset division is now Samsung's biggest earnings generator, raking in record profits. The company appears to be dealing with a profit squeeze from its memory chips with new revenue sources such as mobile processing chips and high-end OLED displays.
The world's biggest technology firm by revenue is likely to report $4.1 billion in October-December analyts think. That would be its best profit since the third quarter of 2010, and up 57 percent from a year ago and 11 percent from the preceding quarter.
In 2012, Samsung is likely to report a 28 percent rise in operating profit with a 12 percent gain in revenue, according to analysts.
Intel Formally Introduces Next-Generation Atom Microprocessors
Intel Corp. on Wednesday formally introduced its new family of microprocessors aimed at low-cost netbooks and similar affordable personal computers. Although media tablets are slowly, but surely ousting netbooks from the market, the world’s largest maker of chips believes that the new Atom processors will be able to successfully address more advanced PCs thanks to improved multimedia capabilities.
Intel Atom 2000-series “Cedarview” system-on-chip with two new Atom cores features integrated Graphics Media Accelerator 3600/3650 DirectX 10.1-capable graphics engine that also supports integrated high-definition video decoder (in order to enable Blu-ray disc playback on all Atom-based systems), improved DDR3 memory controller, digital interfaces for displays along with other improvements. The SoC is made using 32nm fabrication process. The new Intel Atom processors provide a lower thermal design power (TDP) and power management features such as Intel Deeper Sleep and Intel SpeedStep Technology that enable lower power designs.
The dual-core Intel Atom processor N2600 and Intel Atom processor N2800 are paired with the Intel NM10 chipset and feature a small form factor package size that saves system board real estate and enables thinner netbook designs. In addition to the mobile processors, Intel offers the Intel Atom processor D2500 and D2700 for entry-level desktop and all-in-one designs, as well as intelligent system solutions.
Intel incorporated several new features into the platform, such as Intel Wireless Display and Intel Wireless Music, which allow sharing videos or photos wirelessly from netbooks to specially-designed televisions, or stream music through their home stereo speakers.
Intel claims that the new Atom chips provide improved system responsiveness and an improvement in graphics performance up to two times compared to the previous generation platform.
Systems based on the new Intel Atom processors may have up to 10 hours of battery life and weeks of standby, allowing for all-day use between charges. Additionally, Intel increased processor and overall system performance while reducing power consumption up to 20% compared to the previous platform.
Netbooks and ultra-portable netbooks powered by Intel Atom 2000-series microprocessors will be available in early 2012 from major OEMs including: Acer, Asus, HP, Lenovo, Samsung, and Toshiba.
The platform supports a range of operating systems including: Windows, MeeGo, Tizen and a range of embedded OSs.
Intel Atom 2000-series “Cedarview” system-on-chip with two new Atom cores features integrated Graphics Media Accelerator 3600/3650 DirectX 10.1-capable graphics engine that also supports integrated high-definition video decoder (in order to enable Blu-ray disc playback on all Atom-based systems), improved DDR3 memory controller, digital interfaces for displays along with other improvements. The SoC is made using 32nm fabrication process. The new Intel Atom processors provide a lower thermal design power (TDP) and power management features such as Intel Deeper Sleep and Intel SpeedStep Technology that enable lower power designs.
The dual-core Intel Atom processor N2600 and Intel Atom processor N2800 are paired with the Intel NM10 chipset and feature a small form factor package size that saves system board real estate and enables thinner netbook designs. In addition to the mobile processors, Intel offers the Intel Atom processor D2500 and D2700 for entry-level desktop and all-in-one designs, as well as intelligent system solutions.
Intel claims that the new Atom chips provide improved system responsiveness and an improvement in graphics performance up to two times compared to the previous generation platform.
Systems based on the new Intel Atom processors may have up to 10 hours of battery life and weeks of standby, allowing for all-day use between charges. Additionally, Intel increased processor and overall system performance while reducing power consumption up to 20% compared to the previous platform.
Netbooks and ultra-portable netbooks powered by Intel Atom 2000-series microprocessors will be available in early 2012 from major OEMs including: Acer, Asus, HP, Lenovo, Samsung, and Toshiba.
The platform supports a range of operating systems including: Windows, MeeGo, Tizen and a range of embedded OSs.
LG Electronics Unveils World's First Commercial Ultra High-Definition Stereo-3D TV
LG Electronics plans to unveil the world’s largest 3D ultra high-definition (UHD) TV at the Consumer Electronics Show (CES) in Las Vegas. The 84" screen will be the first stereo-3D (S3D) TV-set to support 3840x2160 (4K) resolution. Unfortunately, there will be no commercial S3D 4K content for a while.
“LG is pushing the limits of home entertainment innovation with this 3D UD TV. We are bringing together all our Smart TV and 3D knowledge in the 3D UD TV in order to demonstrate to the CES audience that LG is committed to being the world’s leading brand for immersive home entertainment in 2012 and beyond," said Havis Kwon, President and CEO of LG Electronics Home Entertainment Company
LG’s 3D UD TV boasts superb picture quality with 8 million pixels, four times the resolution clarity (3840x2160) of existing full HD/1080p (1920*1080) TV panels. In addition, the new UHDTV supports stereo-3D technology with proprietary 3D Depth Control that allows users to customize their viewing experience by controlling the stereo-3D effect while 3D Sound Zooming provides users with 3D sound that rivals the output of all but the best home theater systems, according to LG.
Users can access LG’s Smart TV ecosystem, which comprises over 1,200 apps and gives users access to a growing range of premium content services such as the 3D Zone where viewers can select from a wealth of 3D movies. The imbedded 2D to 3D conversion engine expands the availability of 3D content to limitless levels. Users can easily browse and navigate the Smart TV ecosystem using LG’s new, ergonomically-designed Magic Remote which now recognizes four different types of command input: Voice Recognition, Wheel, Magic Gesture and Point.
When the new TV be available and how much LG plans to charge for it remains unknown.
“LG is pushing the limits of home entertainment innovation with this 3D UD TV. We are bringing together all our Smart TV and 3D knowledge in the 3D UD TV in order to demonstrate to the CES audience that LG is committed to being the world’s leading brand for immersive home entertainment in 2012 and beyond," said Havis Kwon, President and CEO of LG Electronics Home Entertainment Company
LG’s 3D UD TV boasts superb picture quality with 8 million pixels, four times the resolution clarity (3840x2160) of existing full HD/1080p (1920*1080) TV panels. In addition, the new UHDTV supports stereo-3D technology with proprietary 3D Depth Control that allows users to customize their viewing experience by controlling the stereo-3D effect while 3D Sound Zooming provides users with 3D sound that rivals the output of all but the best home theater systems, according to LG.
When the new TV be available and how much LG plans to charge for it remains unknown.
Tuesday, January 3, 2012
DRAM Pricing Stabilizes at $16.5 per 4GB Module.
Reduction of manufacturing of dynamic random access memory (DRAM) in late 2011 stabilized memory price in the second half of December despite of seasonally low demand.
According to DRAMeXchange, a research division of TrendForce, while the market has entered the traditionally weak PC shipment season, compared with the first half of December, in the second half of December contract price showed a flat price trend. DDR3 4GB and DDR3 2GB average selling price was $16.5 and $9.25, respectively.
Average 2Gb chip price stayed at the $0.88 level. From the market perspective, although there has been no concrete evidence showing that demand will recover significantly in Q1 2012, the decrease in shipment volume caused by several DRAM makers’ previous capacity cuts will undoubtedly benefit demand recovery; some PC OEMs have increased their DRAM purchase volume in order to avoid possible supply insufficiency in the near future.
As Chinese New Year is around the corner, January transaction volume is expected to be affected slightly by the decrease in the number of work days. Luckily, the effects of the prior capacity cuts will gradually be seen, and as concerns of the HDD supply shortage slowly dissipate as well, it is likely that DRAM contract price will see a stable price trend in the near future.
According to DRAMeXchange, a research division of TrendForce, while the market has entered the traditionally weak PC shipment season, compared with the first half of December, in the second half of December contract price showed a flat price trend. DDR3 4GB and DDR3 2GB average selling price was $16.5 and $9.25, respectively.
Average 2Gb chip price stayed at the $0.88 level. From the market perspective, although there has been no concrete evidence showing that demand will recover significantly in Q1 2012, the decrease in shipment volume caused by several DRAM makers’ previous capacity cuts will undoubtedly benefit demand recovery; some PC OEMs have increased their DRAM purchase volume in order to avoid possible supply insufficiency in the near future.
As Chinese New Year is around the corner, January transaction volume is expected to be affected slightly by the decrease in the number of work days. Luckily, the effects of the prior capacity cuts will gradually be seen, and as concerns of the HDD supply shortage slowly dissipate as well, it is likely that DRAM contract price will see a stable price trend in the near future.
Apple's Jonathan Ive Becomes UK's Knight.
The designer behind Apple iPhone, iPad and various Macs - Jonathan Ive - has just got Knight Commander of the British Empire (KBE) title from the Queen. Mr. Ive has been working at Apple for over fifteen years.
"I am keenly aware that I benefit from a wonderful tradition in the UK of designing and making. I discovered at an early age that all I've ever wanted to do is design," said Jonathan Ive, the head of design at Apple, in an interview with BBC.
London-born designer Jonathan Ive is the senior vice president of industrial design at Apple. Since 1996, he has been responsible for leading a design team widely regarded as one of the world’s best. Mr. Ive holds a Bachelor of Arts and an honorary doctorate from Newcastle Polytechnic. In 2003, he was named designer of the year by the design museum London and awarded the title Royal Designer for Industry by The Royal Society of Arts.
Steve Jobs, a co-founder of Apple, described Mr Ive as his "spiritual partner" in his biography written by Walter Isaacson. However, some say that Mr. Ive was "hurt" by Mr. Jobs taking credit for innovations that came from the design team, according to BBC.
"I am keenly aware that I benefit from a wonderful tradition in the UK of designing and making. I discovered at an early age that all I've ever wanted to do is design," said Jonathan Ive, the head of design at Apple, in an interview with BBC.
London-born designer Jonathan Ive is the senior vice president of industrial design at Apple. Since 1996, he has been responsible for leading a design team widely regarded as one of the world’s best. Mr. Ive holds a Bachelor of Arts and an honorary doctorate from Newcastle Polytechnic. In 2003, he was named designer of the year by the design museum London and awarded the title Royal Designer for Industry by The Royal Society of Arts.
Steve Jobs, a co-founder of Apple, described Mr Ive as his "spiritual partner" in his biography written by Walter Isaacson. However, some say that Mr. Ive was "hurt" by Mr. Jobs taking credit for innovations that came from the design team, according to BBC.
AMD Readies “Sea Islands” Family of Graphics Processors.
The recent firings from Advanced Micro Devices apparently reduced not only marketing and PR personnel, but also engineers. Fired in November, 2011, a hardware designer from AMD has disclosed the code-name of the company’s next-generation of graphics processors – Sea Islands – over at his profile in LinkedIn social network.
Alexander Shternshain, a former MTS design engineer at AMD, who is looking for a new job now, has unveiled the name of AMD’s future graphics processors: Sea Islands. The new family will likely emerge in 2012 or in 2013 and will be most probably be made using 28nm fabrication process at Taiwan Semiconductor Manufacturing Company. According to VR-Zone web-site, Sea Islands name “directly refers to the chain of islands on the USA's Atlantic coast”.
Based on his LinkedIn profile, Mr. Shternshain was involved in design of the latest AMD families of graphic processors starting with Evergreen and Northern Islands (Radeon HD) GPU families, Fusion APUs (Ontario, Llano, Krishna), and the Southern Islands and Sea Islands GPU families.
Actual specifications or peculiarities of the Sea Islands product family remain unknown. What is natural to expect is further development of GCN [graphics core next] architecture with the addition of multimedia-related features, gneral purpose computing and graphics performance improvements. The Sea Islands lineup will likely continue to belong to DirectX 11.1 generation of GPUs.
AMD did not comment on the news-story.
Alexander Shternshain, a former MTS design engineer at AMD, who is looking for a new job now, has unveiled the name of AMD’s future graphics processors: Sea Islands. The new family will likely emerge in 2012 or in 2013 and will be most probably be made using 28nm fabrication process at Taiwan Semiconductor Manufacturing Company. According to VR-Zone web-site, Sea Islands name “directly refers to the chain of islands on the USA's Atlantic coast”.
Based on his LinkedIn profile, Mr. Shternshain was involved in design of the latest AMD families of graphic processors starting with Evergreen and Northern Islands (Radeon HD) GPU families, Fusion APUs (Ontario, Llano, Krishna), and the Southern Islands and Sea Islands GPU families.
Actual specifications or peculiarities of the Sea Islands product family remain unknown. What is natural to expect is further development of GCN [graphics core next] architecture with the addition of multimedia-related features, gneral purpose computing and graphics performance improvements. The Sea Islands lineup will likely continue to belong to DirectX 11.1 generation of GPUs.
AMD did not comment on the news-story.
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